Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US18170938Application Date: 2023-02-17
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Publication No.: US12183819B2Publication Date: 2024-12-31
- Inventor: Hiroyuki Fujisawa , Akimasa Kinoshita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JP2020-046991 20200317
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/10 ; H01L29/16

Abstract:
A semiconductor device includes a semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a second semiconductor layer of a second conductivity type, first semiconductor regions of the first conductivity type, second semiconductor regions of the second conductivity type, gate insulating films, gate electrodes, an insulating film, first electrodes, a second electrode, and trenches. The first semiconductor regions and the second semiconductor regions are periodically disposed apart from one another in a first direction in which the trenches extend in a stripe pattern.
Public/Granted literature
- US20230207680A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2023-06-29
Information query
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