Invention Grant
- Patent Title: Thin film transistor including a hydrogen-blocking dielectric barrier and methods for forming the same
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Application No.: US18432574Application Date: 2024-02-05
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Publication No.: US12183825B2Publication Date: 2024-12-31
- Inventor: Neil Quinn Murray , Mauricio Manfrini , Hung-Wei Li
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L29/786

Abstract:
A thin film transistor includes an insulating matrix layer including an opening therein, a hydrogen-blocking dielectric barrier layer continuously extending over a bottom surface and sidewalls of the opening and over a top surface of the insulating matrix layer, a gate electrode located within the opening, a stack of a gate dielectric and a semiconducting metal oxide plate overlying the gate electrode and horizontally-extending portions of the hydrogen-blocking dielectric barrier layer that overlie the insulating matrix layer, and a source electrode and a drain electrode contacting a respective portion of a top surface of the semiconducting metal oxide plate.
Public/Granted literature
- US20240178322A1 THIN FILM TRANSISTOR INCLUDING A HYDROGEN-BLOCKING DIELECTRIC BARRIER AND METHODS FOR FORMING THE SAME Public/Granted day:2024-05-30
Information query
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