Invention Grant
- Patent Title: LED module and display device having led module
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Application No.: US17570398Application Date: 2022-01-07
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Publication No.: US12183865B2Publication Date: 2024-12-31
- Inventor: Hideaki Abe
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP2019-130140 20190712
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L25/075 ; H01L33/62

Abstract:
An LED module includes a first protrusion and a second protrusion adjacent to the first protrusion arranged on an insulating surface, a first electrode arranged on the first protrusion, and a second electrode arranged on the second protrusion, and an LED chip arranged on upper sides of the first protrusion and the second protrusion. The LED chip is connected to the first electrode and the second electrode via conductive members, and the first protrusion and the second protrusion are insulative and have a height of 1 μm to 50 μm.
Public/Granted literature
- US20220131061A1 LED MODULE AND DISPLAY DEVICE HAVING LED MODULE Public/Granted day:2022-04-28
Information query
IPC分类: