Invention Grant
- Patent Title: Laser module
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Application No.: US17607419Application Date: 2020-05-20
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Publication No.: US12184034B2Publication Date: 2024-12-31
- Inventor: Yohei Enya , Yuki Nakamura , Hiromi Nakanishi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: XSENSUS LLP
- Priority: JP2019-111892 20190617
- International Application: PCT/JP2020/019960 WO 20200520
- International Announcement: WO2020/255611 WO 20201224
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01L23/10 ; H01S5/02212 ; H01S5/0222 ; H01S5/02255 ; H01S5/0236 ; H01S5/024 ; H01S5/028 ; H01S5/40 ; H01S5/02253

Abstract:
A laser module includes a base, a carrier mounted on the base, a laser diode mounted on the carrier, an organic adhesive layer provided between the laser diode and the carrier, the organic adhesive layer having an exposed portion exposed between the laser diode and the carrier, a cap fixed to the base, the cap covering the carrier, the laser diode, and the organic adhesive layer, and a cover material covering at least a part of the exposed portion of the organic adhesive layer.
Public/Granted literature
- US20220224072A1 LASER MODULE Public/Granted day:2022-07-14
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