Invention Grant
- Patent Title: Method for making printed wiring board, printed wiring board, and adhesive film for making printed wiring board
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Application No.: US17684620Application Date: 2022-03-02
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Publication No.: US12185477B2Publication Date: 2024-12-31
- Inventor: Habib Hichri
- Applicant: AJINOMOTO CO., INC.
- Applicant Address: JP Tokyo
- Assignee: AJINOMOTO CO., INC.
- Current Assignee: AJINOMOTO CO., INC.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H05K3/06 ; H05K3/40
Abstract:
By interposing a hard mask between a dielectric and photo-sensitive material it is possible to form fine via in the dielectric by dry etching without damaging the remaining surface of the dielectric.
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Information query
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