An integrated circuit package includes a package structure including a plurality of first dies, a second redistribution structure, a second die and a second encapsulant. The package structure includes the first dies, a first encapsulant encapsulating the first dies, a first redistribution structure over the first encapsulant and a plurality of conductive pillars over the first redistribution structure. The second redistribution structure is disposed over the package structure, and electrically connected to the package structure through the conductive pillars. The second die is disposed between the conductive pillars and electrically connected to the second redistribution structure, wherein a first surface of the second die is substantially flush with a surface of the first redistribution structure and a second surface opposite to the first surface of the second die is substantially flush with a surface of the second redistribution structure. The second encapsulant encapsulates the conductive pillars and the second die.