Invention Grant
- Patent Title: Composite integrated film, composite integrated film supply wafer, and semiconductor composite device
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Application No.: US17504306Application Date: 2021-10-18
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Publication No.: US12191292B2Publication Date: 2025-01-07
- Inventor: Takuma Ishikawa , Takahito Suzuki , Kenichi Tanigawa , Hironori Furuta , Toru Kosaka , Yusuke Nakai , Shinya Jyumonji , Genichiro Matsuo , Chihiro Takahashi , Hiroto Kawada , Yuuki Shinohara
- Applicant: Oki Electric Industry Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C.
- Priority: JP2020-190406 20201116
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L33/62

Abstract:
A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.
Public/Granted literature
- US20220157796A1 COMPOSITE INTEGRATED FILM, COMPOSITE INTEGRATED FILM SUPPLY WAFER, AND SEMICONDUCTOR COMPOSITE DEVICE Public/Granted day:2022-05-19
Information query
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