An antenna package according to an embodiment includes an antenna unit, and a circuit board electrically connected to the antenna unit. The circuit board may include a core layer, a signal transmission wiring disposed on one surface of the core layer, the signal transmission wiring having one end portion connected to the antenna unit, a ground layer disposed on an opposite surface facing the one surface of the core layer, and a first via structure formed through the core layer and arranged around the one end portion of the signal transmission wiring to be in contact with the ground layer.