Invention Grant
- Patent Title: Methods and systems for transmitting and receiving data packets through a bonded connection
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Application No.: US17666183Application Date: 2022-02-07
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Publication No.: US12192030B2Publication Date: 2025-01-07
- Inventor: Patrick Ho Wai Sung , Kam Chiu Ng , Wan Chun Leung
- Applicant: Pismo Labs Technology Limited
- Applicant Address: HK Kowloon
- Assignee: Pismo Labs Technology Limited
- Current Assignee: Pismo Labs Technology Limited
- Current Assignee Address: HK Kowloon
- Agency: Stein IP, LLC
- Main IPC: H04L67/5682
- IPC: H04L67/5682 ; H04L12/28 ; H04L12/46 ; H04L43/087

Abstract:
The present invention relates to methods and systems for transmitting and receiving data packets between a first network node and a second network node through a bonded connection. At the first network node, a data packet, a session identification of the data packet and a time value of the data packet are encapsulated in an encapsulating packet. The first network node sends the encapsulating packet from the first network node to the second network node through the bonded connection. The second network node then stores the encapsulating packet after receiving it and determines an expiration time of the encapsulating packet. When the expiration time of the encapsulating packet expired, the second network node dequeues the encapsulating packet and forwards the data packet according to destination of the data packet.
Public/Granted literature
- US20220263681A1 METHODS AND SYSTEMS FOR TRANSMITTING AND RECEIVING DATA PACKETS THROUGH A BONDED CONNECTION Public/Granted day:2022-08-18
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