Invention Grant
- Patent Title: Substrate support and plasma processing apparatus
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Application No.: US17036943Application Date: 2020-09-29
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Publication No.: US12198906B2Publication Date: 2025-01-14
- Inventor: Hajime Tamura
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP2019-181574 20191001
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683 ; H01L21/687

Abstract:
A substrate support includes a substrate supporting surface, an electrode, a power supply line, and a power supply terminal. The electrode is disposed below the substrate supporting surface and configured to provide a bias power. The power supply line is disposed below the electrode and configured to apply the bias power to the electrode. The power supply terminal is configured to electrically couple the electrode and the power supply line. Further, an area of a surface of the power supply terminal that is coupled to the electrode is greater than an area of a surface of the power supply terminal that is coupled to the power supply line.
Public/Granted literature
- US20210098239A1 SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-04-01
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