Invention Grant
- Patent Title: Substrate support designs for a deposition chamber
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Application No.: US17277152Application Date: 2019-07-03
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Publication No.: US12198967B2Publication Date: 2025-01-14
- Inventor: Kaushik Rao , Govinda Raj , Anubhav Srivastava , Santhosh Kumar Pillappa
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Priority: IN201841040138 20181024
- International Application: PCT/US2019/040459 WO 20190703
- International Announcement: WO2020/086122 WO 20200430
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32 ; H01T23/00
Abstract:
The present disclosure generally relates to a substrate support that includes a body having a substrate receiving surface, the body comprising a dielectric material. The body also includes a first foil embedded in the body below the substrate receiving surface. The body also includes an electrically conductive mesh embedded in the body below the first foil. The body also includes a center tap structure formed in a bottom surface of the body that is in electrical communication with the mesh.
Public/Granted literature
- US20210375658A1 SUBSTRATE SUPPORT DESIGNS FOR A DEPOSITION CHAMBER Public/Granted day:2021-12-02
Information query
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