Invention Grant
- Patent Title: Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate
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Application No.: US17742044Application Date: 2022-05-11
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Publication No.: US12199006B2Publication Date: 2025-01-14
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2016-010676 20160122,JP2017-000417 20170105
- Main IPC: H01L23/373
- IPC: H01L23/373 ; B23K35/30 ; H01L21/48 ; H01L23/15
Abstract:
A bonded body of the present invention includes a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy. In a bonding layer formed between the ceramic member and the Cu member, an area ratio of a Cu3P phase in a region extending by up to 50 μm toward the Cu member side from a bonding surface of the ceramic member is equal to or lower than 15%.
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