Ball grid array for a semiconductor integrated circuit device
Abstract:
An electronic apparatus includes an integrated circuit board on, over, or in which a USB circuit block is provided; a first USB interface; a second USB interface; a printed circuit board on which a source clock circuit configured to output a source clock is provided; and a ball grid array that includes first, second, and third ball grids for electric coupling between the integrated circuit board and the printed circuit board. The first ball grid electrically couples the USB circuit block and the first USB interface to each other. The second ball grid electrically couples the USB circuit block and the second USB interface to each other. The third ball grid electrically couples the source clock circuit and the USB circuit block to each other. The third ball grid is located between the first ball grid and the second ball grid.
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