Invention Grant
- Patent Title: Ball grid array for a semiconductor integrated circuit device
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Application No.: US17464874Application Date: 2021-09-02
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Publication No.: US12199023B2Publication Date: 2025-01-14
- Inventor: Katsuo Takeuchi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2020-149102 20200904
- Main IPC: H01L23/498
- IPC: H01L23/498 ; G06F13/42 ; H01L23/00 ; H05K1/11

Abstract:
An electronic apparatus includes an integrated circuit board on, over, or in which a USB circuit block is provided; a first USB interface; a second USB interface; a printed circuit board on which a source clock circuit configured to output a source clock is provided; and a ball grid array that includes first, second, and third ball grids for electric coupling between the integrated circuit board and the printed circuit board. The first ball grid electrically couples the USB circuit block and the first USB interface to each other. The second ball grid electrically couples the USB circuit block and the second USB interface to each other. The third ball grid electrically couples the source clock circuit and the USB circuit block to each other. The third ball grid is located between the first ball grid and the second ball grid.
Public/Granted literature
- US20220077042A1 ELECTRONIC APPARATUS AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2022-03-10
Information query
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