Invention Grant
- Patent Title: Non-conformal oxide liner and manufacturing methods thereof
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Application No.: US18178644Application Date: 2023-03-06
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Publication No.: US12199158B2Publication Date: 2025-01-14
- Inventor: Ming-Ho Lin , Chun-Heng Chen , Xiong-Fei Yu , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/8234 ; H01L29/417 ; H01L29/66 ; H01L29/78

Abstract:
A method includes forming a fin protruding over a substrate; forming a conformal oxide layer over an upper surface and along sidewalls of the fin; performing an anisotropic oxide deposition or an anisotropic plasma treatment to form a non-conformal oxide layer over the upper surface and along the sidewalls of the fin; and forming a gate electrode over the fin, the conformal oxide layer and the non-conformal oxide layer being between the fin and the gate electrode.
Public/Granted literature
- US20230207646A1 NON-CONFORMAL OXIDE LINER AND MANUFACTURING METHODS THEREOF Public/Granted day:2023-06-29
Information query
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