Invention Grant
- Patent Title: Microphone package for epoxy overflow protection guard ring in cavity pcb
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Application No.: US17632205Application Date: 2019-12-30
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Publication No.: US12200418B2Publication Date: 2025-01-14
- Inventor: Shane Zhang , Joshua Watson , Fisher Yu , Jonas Shen
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: FLENER IP & Business Law
- Agent Zareefa B. Flener
- International Application: PCT/CN2019/129906 WO 20191230
- International Announcement: WO2021/134208 WO 20210708
- Main IPC: H04R1/04
- IPC: H04R1/04 ; B81B7/00 ; H01L21/56 ; H04R1/08 ; H04R19/04

Abstract:
A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.
Public/Granted literature
- US20220286766A1 MICROPHONE PACKAGE FOR EPOXY OVERFLOW PROTECTION GUARD RING IN CAVITY PCB Public/Granted day:2022-09-08
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