Invention Grant
- Patent Title: 3D and flash memory device
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Application No.: US17570172Application Date: 2022-01-06
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Publication No.: US12200933B2Publication Date: 2025-01-14
- Inventor: Cheng-Yu Lee , Teng-Hao Yeh
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. PATENTS
- Main IPC: H10B43/20
- IPC: H10B43/20 ; H10B41/27 ; H10B43/10 ; H10B43/27

Abstract:
A three-dimensional AND flash memory device includes a gate stack structure and a silt. The silt extends along a first direction and divides the gate stack structure into a plurality of sub-blocks. Each sub-block includes a plurality of rows, and each row includes a plurality of channel pillars, a plurality of charge storage structures, and a plurality of pairs of conductive pillars. The plurality of pairs of conductive pillars are arranged in the plurality of channel pillars and penetrate the gate stack structure, and are respectively connected to the plurality of channel pillars. Each pair of conductive pillars includes a first conductive pillar and a second conductive pillar separated from each other along a second direction. There is an acute angle between the second direction and the first direction.
Public/Granted literature
- US20230217655A1 3D AND FLASH MEMORY DEVICE Public/Granted day:2023-07-06
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