According to one embodiment, a semiconductor memory device includes first to second areas, a plurality of conductive layers, first to fourth members, and a plurality of pillars. The second area includes a first contact area including first to third sub-areas. The conductive layers include first to fourth conductive layers. The first conductive layer includes a first terrace portion in the first sub-area. The second conductive layer includes a second terrace portion in the third sub-area. The third conductive layer includes a third terrace portion in the first sub-area. The fourth conductive layer includes a fourth terrace portion in the third sub-area.