Invention Grant
- Patent Title: Non-volatile memory die with bit-flip object insertion
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Application No.: US17847101Application Date: 2022-06-22
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Publication No.: US12205252B2Publication Date: 2025-01-21
- Inventor: Daniel Joseph Linnen , Ramanathan Muthiah , Kirubakaran Periyannan , Nikita Thacker
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: LOZA & LOZA, LLP
- Agent Gabriel Fitch
- Main IPC: G06V10/00
- IPC: G06V10/00 ; G06T5/50 ; G06T7/194 ; G06T7/90

Abstract:
Bit-flip object insertion techniques are provided for use with a non-volatile memory (NVM) wherein an object is inserted into a background image by flipping or inverting one or more bits within the pixels of the background image that correspond to the shape and insertion location of an object being inserted. In an illustrative example, pixels within the background image that correspond to the shape and insertion location of the object are XORed with binary 1s. This flips the bits of those pixels to change the color (hue) and/or intensity (brightness) of the pixels so the object appears in the background image. In other examples, only the most significant bits of pixels in the background image are inverted (flipped). Exemplary latch-based procedures are described herein for high-speed processing on an NVM die. Multiple plane NVM die implementations are also described for massive processing.
Public/Granted literature
- US20230419464A1 NON-VOLATILE MEMORY DIE WITH BIT-FLIP OBJECT INSERTION Public/Granted day:2023-12-28
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