The present invention provides a multi-die package including main die, a memory die, a first set of pins and a second set of pins. The main die includes a memory controller, a first set of pads, a second set of pads and a third set of pads. The memory die is coupled to the first set of pads and the second set of pads of the main die. The first set of pins is coupled to the third set of pads of the main die. The second set of pins is coupled to the second set of pads of the main die. The memory controller accesses the memory die through the first set of pads and the second set of pads, and the memory controller accesses a memory chip external to the multi-die package through the second set of pads and the third set of pads.