Invention Grant
- Patent Title: Coil component
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Application No.: US17215778Application Date: 2021-03-29
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Publication No.: US12205747B2Publication Date: 2025-01-21
- Inventor: Kang Wook Bong , Jae Youn Park , Jin Won Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0184277 20201228
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/32 ; H01F41/04 ; H01F41/12

Abstract:
A coil component includes a body, a support substrate disposed within the body, a coil disposed on at least one surface of the support substrate, and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the coil. The coil unit includes a first conductive layer disposed on the support substrate, a second conductive layer disposed on the first conductive layer and spaced apart from the support substrate, and a third conductive layer disposed on the second conductive layer to cover at least a portion of a side surface of the second conductive layer and spaced apart from the support substrate to expose a side surface of the first conductive layer.
Public/Granted literature
- US20220208433A1 COIL COMPONENT Public/Granted day:2022-06-30
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