Invention Grant
- Patent Title: Electronic component module and method for manufacturing electronic component module
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Application No.: US17653703Application Date: 2022-03-07
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Publication No.: US12205858B2Publication Date: 2025-01-21
- Inventor: Ryohei Okabe
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Pearne & Gordon LLP
- Priority: JP2019-165804 20190912
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/544 ; H01L23/552 ; H01L25/065 ; H01L25/16
Abstract:
An electronic component module includes a substrate, a mounting-type electronic component, a mounting-type electronic component, an insulating resin, and an insulating resin. The mounting-type electronic component is mounted on a first main surface of the substrate. The mounting-type electronic component is mounted on a second main surface of the substrate. The insulating resin covers the first main surface and the first mounting-type electronic component. The insulating resin covers the second main surface and the second mounting-type electronic component. The first mounting-type electronic component is an electronic component including a semiconductor substrate. A top surface of the semiconductor substrate of the first mounting-type electronic component opposite to the first main surface is exposed from the insulating resin. Printing is applied to the top surface, which is an exposed surface of the semiconductor substrate.
Public/Granted literature
- US20220189838A1 ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE Public/Granted day:2022-06-16
Information query
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