Invention Grant
- Patent Title: Semiconductor component with a stress compensation layer and a method for manufacturing a semiconductor component
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Application No.: US17264320Application Date: 2019-07-31
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Publication No.: US12206044B2Publication Date: 2025-01-21
- Inventor: André Steiner , Christine Rafael , Paola Altieri-Weimar
- Applicant: OSRAM OLED GMBH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GMBH
- Current Assignee: OSRAM OLED GMBH
- Current Assignee Address: DE Regensburg
- Agency: VIERING, JENTSCHURA & PARTNER mbB
- Priority: DE102018118824.2 20180802
- International Application: PCT/EP2019/070680 WO 20190731
- International Announcement: WO2020/025700 WO 20200206
- Main IPC: H01L33/12
- IPC: H01L33/12 ; H01L33/62 ; H01S5/22 ; H01S5/32
Abstract:
A semiconductor device may include a conductive layer over a semiconductor body and a first stress compensation layer adjacent to the conductive layer. The stress compensation layer may include a defined first stress.
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