- Patent Title: Temperature compensation in infrared imaging systems and methods
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Application No.: US17744497Application Date: 2022-05-13
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Publication No.: US12207016B2Publication Date: 2025-01-21
- Inventor: Per O. Elmfors
- Applicant: Teledyne FLIR Commercial Systems, Inc.
- Applicant Address: US CA Goleta
- Assignee: Teledyne FLIR Commercial Systems, Inc.
- Current Assignee: Teledyne FLIR Commercial Systems, Inc.
- Current Assignee Address: US CA Goleta
- Agency: Haynes and Boone, LLP
- Main IPC: H04N5/33
- IPC: H04N5/33 ; G01J5/20 ; G01J5/24 ; G01J5/70

Abstract:
Techniques for facilitating temperature compensation are provided. In one example, an infrared imaging system includes a focal plane array configured to capture radiation from a scene and generate image data based on the radiation. The focal plane array further captures radiation from an element associated with the infrared imaging system during capture of the radiation from the scene. The infrared imaging system further includes a temperature sensor configured to determine a temperature of the focal plane array. The infrared imaging system further includes a processing circuit configured to determine a temperature associated with the element based on the temperature of the focal plane array. The processing circuit is further configured to determine a temperature associated with an object in the scene based on the infrared image data, the temperature associated with the element, and the temperature of the focal plane array. Related devices and methods are also provided.
Public/Granted literature
- US20230048503A1 TEMPERATURE COMPENSATION IN INFRARED IMAGING SYSTEMS AND METHODS Public/Granted day:2023-02-16
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