Invention Grant
- Patent Title: Memory device and methods of forming same
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Application No.: US17238678Application Date: 2021-04-23
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Publication No.: US12207478B2Publication Date: 2025-01-21
- Inventor: Chenchen Jacob Wang , Sai-Hooi Yeong , Yu-Ming Lin , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H10B61/00
- IPC: H10B61/00 ; H01L21/02 ; H01L29/24 ; H10N50/01

Abstract:
In an embodiment, a semiconductor device includes a first dielectric layer over a substrate and a first access transistor and a second access transistor in a memory cell of a memory array, the first access transistor and the second access transistor each including a bottom electrode in the first dielectric layer, a conductive gate in a second dielectric layer, where the second dielectric layer is over the bottom electrode and the first dielectric layer, a channel region extending through the conductive gate to contact the bottom electrode, and a top electrode over the channel region.
Public/Granted literature
- US20220344402A1 MEMORY DEVICE AND METHODS OF FORMING SAME Public/Granted day:2022-10-27
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