Invention Grant
- Patent Title: Semiconductor memory device having memory chip bonded to a CMOS chip including a peripheral circuit
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Application No.: US18239140Application Date: 2023-08-29
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Publication No.: US12211544B2Publication Date: 2025-01-28
- Inventor: Hiroshi Maejima
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2021-045906 20210319
- Main IPC: G11C7/12
- IPC: G11C7/12 ; G11C5/06 ; G11C11/4074 ; G11C11/408 ; G11C11/4091 ; G11C11/4094 ; G11C16/04 ; G11C16/24 ; G11C16/26 ; G11C7/18 ; H10B43/10

Abstract:
A memory device includes a first memory cell provided above a substrate; a first bit line coupled to the first memory cell and extending in a first direction; a first sense amplifier configured to sense a voltage of the first bit line; a second memory cell provided above the substrate; a second bit line adjacent to the first bit line and extending in the first direction, the second bit line being coupled to the second memory cell; a second sense amplifier configured to sense a voltage of the second bit line; and a third memory cell provided above the substrate. A third bit line not adjacent to the second bit line extends in the first direction, and is coupled to the third memory cell; and a third sense amplifier is configured to sense a voltage of the third bit line. The first and second sense amplifiers belong to a first sense amplifier group, are adjacent to each other and are arranged in a second direction intersecting the first direction. The third sense amplifier belongs to a second sense amplifier group. The first and second sense amplifier groups are adjacent to each other and are arranged in the first direction.
Public/Granted literature
- US20230402087A1 SEMICONDUCTOR MEMORY DEVICE HAVING MEMORY CHIP BONDED TO A CMOS CHIP INCLUDING A PERIPHERAL CIRCUIT Public/Granted day:2023-12-14
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