Invention Grant
- Patent Title: Printed circuit board and electronic component package including the same
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Application No.: US17682135Application Date: 2022-02-28
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Publication No.: US12211816B2Publication Date: 2025-01-28
- Inventor: Young Kuk Ko , Sang Hoon Kim , Suk Chang Hong , Chi Won Hwang , Gyu Mook Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2021-0042771 20210401,KR10-2021-0115617 20210831
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/683 ; H01L23/13 ; H01L23/31 ; H01L23/485 ; H01L23/498 ; H01L23/538 ; H05K1/02 ; H05K1/14 ; H05K1/18
Abstract:
A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.
Public/Granted literature
- US20220320027A1 PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME Public/Granted day:2022-10-06
Information query
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