Invention Grant
- Patent Title: Field effect transistors comprising a matrix of gate-all-around channels
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Application No.: US17384416Application Date: 2021-07-23
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Publication No.: US12211848B2Publication Date: 2025-01-28
- Inventor: Julien Frougier , Ruilong Xie , Kangguo Cheng , Chanro Park
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/02 ; H01L21/28 ; H01L21/306 ; H01L21/768 ; H01L21/8238 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/49 ; H01L29/66 ; H01L29/775 ; H01L29/786

Abstract:
Provided is a semiconductor structure with shared gated devices. The semiconductor structure comprises a substrate and a bottom dielectric isolation (BDI) layer on top of the substrate. The structure further comprises a pFET region that includes a p-doped Source-Drain epitaxy material and a first nanowire matrix above the BDI layer. The structure further comprises an nFET region that includes a n-doped Source-Drain epitaxy material and a second nanowire matrix above the BDI layer. The structure further comprises a conductive gate material on top of a portion of the first nanowire matrix and the second nanowire matrix. The structure further comprises a vertical dielectric pillar separating the pFET region and the nFET region. The vertical dielectric pillar extends downward through the BDI layer into the substrate. The vertical dielectric pillar further extends upward through the conductive gate material to a dielectric located above the gate region.
Public/Granted literature
- US20230027293A1 FIELD EFFECT TRANSISTORS COMPRISING A MATRIX OF GATE-ALL-AROUND CHANNELS Public/Granted day:2023-01-26
Information query
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