Invention Grant
- Patent Title: Demodulation reference signal bundling and frequency hopping
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Application No.: US17586553Application Date: 2022-01-27
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Publication No.: US12213130B2Publication Date: 2025-01-28
- Inventor: Hung Dinh Ly , Gokul Sridharan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Holland & Hart / QUALCOMM Incorporated
- Main IPC: H04W72/1268
- IPC: H04W72/1268 ; H04L5/00 ; H04W72/23 ; H04W72/50

Abstract:
Methods, systems, and devices for wireless communication are described to support phase continuity in uplink transmissions within a bundle interval. In a first example, a user equipment (UE) may determine bundle intervals for an uplink channel transmission based on a transmission time interval (TTI) format pattern and a bundle size. Bundle intervals may start on a next available uplink TTI after an end of a preceding bundle interval, such that each bundle interval may include at least one uplink TTI. In a second example, the UE may use frequency resources for repetitions of the uplink channel transmission within a bundle interval based on an index of the bundle interval. In a third example, the UE may not bundle some repetitions of the uplink channel transmission in a same bundle interval, and may use different frequency resources for the repetitions, based on one or more phase continuity rules.
Public/Granted literature
- US20220248430A1 DEMODULATION REFERENCE SIGNAL BUNDLING AND FREQUENCY HOPPING Public/Granted day:2022-08-04
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