Invention Grant
- Patent Title: Carrier device for variable thickness E1.S storage devices
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Application No.: US18066057Application Date: 2022-12-14
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Publication No.: US12213272B2Publication Date: 2025-01-28
- Inventor: Yaw-Tzorng Tsorng , Tung-Hsien Wu , Yu-Ying Tseng , Wei-Jie Chen
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Taoyuan
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Taoyuan
- Agency: NIXON PEABODY LLP
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A carrier for different form factors for insertion in a slot of a computing device is disclosed. The different form factors have different thicknesses defined by the E1.S specification. The carrier includes a base holding a first type of form factor. A bezel is configurable for insertion in a slot for a device of the first type of form factor. The bezel has an attachment surface. The base is attachable to the attachment surface of the bezel. A second type of form factor is also attachable to the attachment surface of the bezel. A cover encloses the first type of form factor when joined to the base. The base and cover are discarded when the second type of form factor is attached to the bezel. The attached bezel and second type of form factor may also be inserted in the slot.
Public/Granted literature
- US20240155798A1 CARRIER DEVICE FOR VARIABLE THICKNESS E1.S STORAGE DEVICES Public/Granted day:2024-05-09
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