Invention Grant
- Patent Title: Thermoplastic moulding compound
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Application No.: US17432540Application Date: 2020-02-18
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Publication No.: US12215213B2Publication Date: 2025-02-04
- Inventor: Jens Cremer , Patrick Spies
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Agency: Armstrong Teasdale LLP
- Priority: EP19158330 20190220
- International Application: PCT/EP2020/054141 WO 20200218
- International Announcement: WO2020/169547 WO 20200827
- Main IPC: C08K7/14
- IPC: C08K7/14 ; C03C3/087 ; C03C13/00 ; C08L77/02 ; C08L77/06

Abstract:
Described herein is a method of using glass fibers having a tensile strength according to DIN ISO 527-5 of 86.0 to 92.0 GPa, a tensile elastic modulus according to DIN ISO 527-5 of 2600 to 3200 MPa and a softening point according to DIN ISO 7884-1 of 900° C. to 950° C., the method including using the glass fibers to increase an impact strength and/or breaking elongation of molded articles made of molding materials including thermoplastic polyamides and elastomers.
Public/Granted literature
- US20220185994A1 THERMOPLASTIC MOULDING COMPOUND Public/Granted day:2022-06-16
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