Invention Grant
- Patent Title: Laminated coil component
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Application No.: US17548405Application Date: 2021-12-10
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Publication No.: US12217893B2Publication Date: 2025-02-04
- Inventor: Yuudai Suzuki , Katsuhisa Imada , Makoto Hiraki , Ikuno Sugiyama , Hiroshi Ueki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2020-208649 20201216
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/29 ; H01F27/32

Abstract:
A laminated coil component includes a multilayer body in which a coil, which is obtained by electrically connecting a plurality of coil conductors with a via conductor interposed therebetween, is provided in an inside of an insulator portion which is obtained by laminating a plurality of insulation layers. Each of a first coil conductor and a second coil conductor that are adjacent to each other in a lamination direction and are electrically connected in series with a first via conductor interposed therebetween includes a first main surface that faces the opposite direction to the lamination direction and on which a void exists. The second coil conductor includes a second main surface that faces the lamination direction and on which another void exists, and the other void locally exists on a position opposed to the first via conductor.
Public/Granted literature
- US20220189674A1 LAMINATED COIL COMPONENT Public/Granted day:2022-06-16
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |