Invention Grant
- Patent Title: Heat controlled switch
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Application No.: US17834944Application Date: 2022-06-08
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Publication No.: US12217924B2Publication Date: 2025-02-04
- Inventor: Yu-Wei Ting , Kuo-Pin Chang , Hung-Ju Li , Kuo-Ching Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H10N10/85
- IPC: H10N10/85 ; H01H37/12 ; H01H37/32

Abstract:
A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate, and a heater element on the semiconductor substrate, the heater element configured to generate heat in response to a current flowing therethrough. The semiconductor device also includes a conductor material having a programmable conductivity, and an insulator layer between the heater element and the conductor material, where the conductor material is configured to be programmed by applying one or more voltage differences to one or more of the heater element and the conductor material, and where a capacitance between the conductor material and the heater element is configured to be controlled by the voltage differences such that the capacitance is lower while the conductor material is being programmed than while the conductor material is not being programmed.
Public/Granted literature
- US20230402241A1 HEAT CONTROLLED SWITCH Public/Granted day:2023-12-14
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