Invention Grant
- Patent Title: Atomic layer etching for smoothing of arbitrary surfaces
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Application No.: US17224037Application Date: 2021-04-06
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Publication No.: US12217968B2Publication Date: 2025-02-04
- Inventor: Harold Frank Greer
- Applicant: California Institute of Technology
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Gates & Cooper LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/3105 ; H01L21/321 ; H01L21/67 ; H01L21/677
Abstract:
A method for etching a surface including obtaining a substrate comprising a material; reacting a surface of a substrate with a reactant, comprising a gas or a plasma, to form a reactive layer on the substrate, the reactive layer comprising a chemical compound including the reactant and the material; and wet etching or dissolving the reactive layer with a liquid wet etchant of solvent that selectively etches or dissolves the reactive layer but not the substrate.
Public/Granted literature
- US20210313185A1 ATOMIC LAYER ETCHING FOR SMOOTHING OF ARBITRARY SURFACES Public/Granted day:2021-10-07
Information query
IPC分类:
