Invention Grant
- Patent Title: Semiconductor apparatus and method of collecting residues
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Application No.: US17395435Application Date: 2021-08-05
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Publication No.: US12217989B2Publication Date: 2025-02-04
- Inventor: Ping-Cheng Lin , Pin-Yi Hsin , Ching Shun Lee , Bo-Han Huang , Cheng-tsung Tu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C23C16/00 ; H01J37/32 ; H01L21/67 ; H01L21/673 ; H01L21/677
Abstract:
A semiconductor apparatus and a method for collecting residues of curable material are provided. The semiconductor apparatus includes a chamber containing a wafer cassette, and a collecting module disposed in the chamber for collecting residues of curable material in the chamber. The collecting module includes a flow-directing structure disposed below a ceiling of the chamber, a baffle structure disposed below the flow-directing structure, and a tray disposed on the wafer cassette. The flow-directing structure includes a first hollow region, the baffle structure includes a second hollow region, and the tray is moved together with the wafer cassette to pass through the second hollow region of the baffle structure and is positioned to cover the first hollow region of the flow-directing structure.
Public/Granted literature
- US20230038785A1 SEMICONDUCTOR APPARATUS AND METHOD OF COLLECTING RESIDUES Public/Granted day:2023-02-09
Information query
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