Invention Grant
- Patent Title: Methods and systems for improving transfer efficiency of an automated material handling system
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Application No.: US18360877Application Date: 2023-07-28
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Publication No.: US12217992B2Publication Date: 2025-02-04
- Inventor: Yen-Fu Shen
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port while a second work-in-progress is transferred to the load port from an AMHS vehicle along a second direction that is perpendicular to the first direction, and transferring the first work-in-progress to an AMHS vehicle along the second direction. The methods and systems may be used for loading and unloading wafer storage containers, such as front opening unified pods (FOUPs), in a semiconductor fabrication facility.
Public/Granted literature
- US20230369088A1 Methods and Systems for Improving Transfer Efficiency of an Automated Material Handling System Public/Granted day:2023-11-16
Information query
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