Invention Grant
- Patent Title: Interferometer systems and methods for real time etch process compensation control
-
Application No.: US17397989Application Date: 2021-08-10
-
Publication No.: US12218015B2Publication Date: 2025-02-04
- Inventor: Chansyun Yang , Chan-Lon Yang , Keh-Jeng Chang , Perng-Fei Yuh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G03F7/00 ; H01L21/02 ; H01L21/66 ; H01L21/027
Abstract:
An apparatus includes a beam conditioning assembly configured to output one or more wavelengths to a substrate being processed and receive one or more reflected wavelengths from the substrate, and a machine learning device configured to process the one or more reflected wavelengths to predict a process variable and compare the predicted process variable with a measured process variable to obtain a comparison result.
Public/Granted literature
- US20220336294A1 INTERFEROMETER SYSTEMS AND METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL Public/Granted day:2022-10-20
Information query
IPC分类:
