Invention Grant
- Patent Title: Electronic module comprising a semiconductor package with integrated clip and fastening element
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Application No.: US16816561Application Date: 2020-03-12
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Publication No.: US12218030B2Publication Date: 2025-02-04
- Inventor: Edward Fuergut , Peter Eibl , Horst Groeninger , Martin Gruber , Christian Kasztelan , Philipp Seng
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP19163200 20190315
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H01L21/56 ; H01L23/00 ; H01L23/495 ; H01L25/11
Abstract:
An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.
Public/Granted literature
- US20200294885A1 Electronic Module Comprising a Semiconductor Package with Integrated Clip and Fastening Element Public/Granted day:2020-09-17
Information query
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