Invention Grant
- Patent Title: Leadframe, semiconductor package and method
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Application No.: US16533315Application Date: 2019-08-06
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Publication No.: US12218038B2Publication Date: 2025-02-04
- Inventor: Chau Fatt Chiang , Paul Armand Asentista Calo , Kok Yau Chua , Josef Hoeglauer , Swee Kah Lee , Khay Chwan Saw
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP18187774 20180807
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48

Abstract:
In an embodiment, a leadframe includes a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first part being spaced apart from the second part by a gap, a first recess arranged in the inner surface of the first part, a second recess arranged in the inner surface of the second part, and a first electrically conductive insert that is arranged in, and extends between, the first recess and the second recess and bridges the gap between the first part and the second part.
Public/Granted literature
- US20200051898A1 Leadframe, Semiconductor Package and Method Public/Granted day:2020-02-13
Information query
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