Invention Grant
- Patent Title: Memory devices and methods of manufacturing thereof
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Application No.: US18514796Application Date: 2023-11-20
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Publication No.: US12218047B2Publication Date: 2025-02-04
- Inventor: Meng-Sheng Chang , Chia-En Huang , Yi-Hsun Chiu , Yih Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/525
- IPC: H01L23/525 ; G11C17/16 ; G11C17/18 ; H10B20/25

Abstract:
A memory device includes a programming transistor and a reading transistor of an anti-fuse memory cell. The programming transistor includes first semiconductor nanostructures vertically spaced apart from one another, each of the first semiconductor nanostructures having a first width along a first lateral direction. The reading transistor includes second semiconductor nanostructures vertically spaced apart from one another, each of the second semiconductor nanostructures having a second width different from the first width along the second direction. The memory device also includes a first and a second gate metals. The first gate metal wraps around each of the first semiconductor nanostructures with a first gate dielectric disposed therein. The second gate metal wraps around each of the second semiconductor nanostructures with a second gate dielectric disposed therein.
Public/Granted literature
- US20240090209A1 MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF Public/Granted day:2024-03-14
Information query
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