Invention Grant
- Patent Title: High electron mobility transistor and method of manufacturing the same
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Application No.: US17902383Application Date: 2022-09-02
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Publication No.: US12218233B2Publication Date: 2025-02-04
- Inventor: Jaejoon Oh , Jongseob Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR10-2020-0035803 20200324
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/285 ; H01L29/20 ; H01L29/205 ; H01L29/423 ; H01L29/66

Abstract:
A high electron mobility transistor and a method of manufacturing the same are disclosed. The high electron mobility transistor includes a channel layer, a channel supplying layer causing generation of a two-dimensional electron gas (2DEG) in the channel layer, a source electrode and a drain electrode provided on respective sides of the channel supplying layer, a depletion forming layer provided on the channel supplying layer to form a depletion region in the 2DEG, a gate electrode provided on a portion of the depletion forming layer, and a current limiting layer provided to contact the gate electrode on another portion of the depletion forming layer. The current limiting layer limits a current flow from the gate electrode to the depletion forming layer according to a voltage applied to the gate electrode.
Public/Granted literature
- US20220416071A1 HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-12-29
Information query
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