Invention Grant
- Patent Title: Growth structure for strained channel, and strained channel using the same and method of manufacturing device using the same
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Application No.: US17522851Application Date: 2021-11-09
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Publication No.: US12218238B2Publication Date: 2025-02-04
- Inventor: Sanghyeon Kim , Hyeongrak Lim
- Applicant: Korea Advanced Institute of Science and Technology
- Applicant Address: KR Daejeon
- Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee: Korea Advanced Institute of Science and Technology
- Current Assignee Address: KR Daejeon
- Agency: CHRISTENSEN O'CONNOR JOHNSON KINDNESS PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/762 ; H01L29/66 ; H01L29/78

Abstract:
Disclosed are a growth structure for a strained channel, and a strained channel using the same and a method of manufacturing a device using the same. The growth structure for a strained channel includes a support substrate, a strain-relaxed buffer (SRB) layer disposed on a support substrate, a base growth layer grown to have one composition on the SRB layer, and a strained channel layer grown to have another composition on the base growth layer. The strained channel layer may include at least one of a tensile-strained channel layer or a compressively strained channel layer.
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