Invention Grant
- Patent Title: Oxide semiconductor transistor structure in 3-d device and methods for forming the same
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Application No.: US18334496Application Date: 2023-06-14
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Publication No.: US12218250B2Publication Date: 2025-02-04
- Inventor: Kuo-Chang Chiang , Hung-Chang Sun , Sheng-Chih Lai , TsuChing Yang , Yu-Wei Jiang , Feng-Cheng Yang , Neil Quinn Murray
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/477 ; H01L29/24 ; H01L29/51 ; H01L29/66 ; H01L29/786

Abstract:
A transistor including a channel layer including an oxide semiconductor material and methods of making the same. The transistor includes a channel layer having a first oxide semiconductor layer having a first oxygen concentration, a second oxide semiconductor layer having a second oxygen concentration and a third oxide semiconductor layer having a third oxygen concentration. The second oxide semiconductor layer is located between the first semiconductor oxide layer and the third oxide semiconductor layer. The second oxygen concentration is lower than the first oxygen concentration and the third oxygen concentration.
Public/Granted literature
- US20230327024A1 Oxide Semiconductor Transistor Structure in 3-D Device and Methods for Forming the Same Public/Granted day:2023-10-12
Information query
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