Invention Grant
- Patent Title: Power amplifier circuit
-
Application No.: US17333299Application Date: 2021-05-28
-
Publication No.: US12218635B2Publication Date: 2025-02-04
- Inventor: Zhixiong Zeng , Jie Sun , Hailei Suo
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H03F1/56 ; H03F3/24 ; H03F3/60

Abstract:
A power amplifier circuit includes: a first branch, including a first amplifier and a first matching network cascaded; a second branch, including a second amplifier and a second matching network cascaded, where a first coupled line enables the first branch and the second branch to form a first combiner; a third branch, including a third amplifier and a third matching network cascaded; and a fourth branch, including a fourth amplifier and a fourth matching network cascaded, where a second coupled line enables the third branch and the fourth branch to form a second combiner. A first output end of the first coupled line is a signal output end of the circuit, and a second output end of the first coupled line is connected to a first output end of the second coupled line, to enable the first combiner and the second combiner to form a series combiner.
Public/Granted literature
- US20210288616A1 POWER AMPLIFIER CIRCUIT Public/Granted day:2021-09-16
Information query
IPC分类: