Invention Grant
- Patent Title: PCB assembly
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Application No.: US17994017Application Date: 2022-11-25
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Publication No.: US12219728B2Publication Date: 2025-02-04
- Inventor: Kyo Sung Ji , Chi Back Ryu , Bae Mook Jeong , Min Seon Yun
- Applicant: KMW INC.
- Applicant Address: KR Hwaseong-si
- Assignee: KMW INC.
- Current Assignee: KMW INC.
- Current Assignee Address: KR Hwaseong-si
- Agency: Insight Law Group, PLLC
- Agent Seung Lee
- Priority: KR10-2020-0063074 20200526
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A PCB assembly is disclosed herein. An embodiment of the present disclosure provides a printed circuit board (PCB) assembly on which a plurality of devices is mounted, including: a power supply area disposed at one side of a main printed circuit board; a first area positioned in another direction of the main printed circuit board from the power supply area and including the plurality of devices; a second area positioned in another direction of the main printed circuit board from the first area and including the plurality of devices; a third area positioned in another direction of the main printed circuit board from the second area and including the plurality of devices; and a bridge printed circuit board receiving power from the power supply area and disposed vertically to the main printed circuit board, wherein the bridge printed circuit board crosses the first area, the second area, and the third area, and transmits power and a signal to at least one area.
Public/Granted literature
- US20230090243A1 PCB ASSEMBLY Public/Granted day:2023-03-23
Information query