Invention Grant
- Patent Title: Converter including heat transfer layer
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Application No.: US17770766Application Date: 2020-11-13
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Publication No.: US12219742B2Publication Date: 2025-02-04
- Inventor: Jae hoo Jung
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2019-0145059 20191113
- International Application: PCT/KR2020/016023 WO 20201113
- International Announcement: WO2021/096305 WO 20210520
- Main IPC: H05K7/20
- IPC: H05K7/20 ; C09K5/14 ; H05K5/00 ; H05K5/02 ; H05K5/03

Abstract:
A converter comprises: a housing comprising a refrigerant flow path; a printed circuit board disposed on top of the housing and on the upper surface of which an electronic component is disposed; and a cover disposed on top of the printed circuit board and which covers the upper surface of the electronic component, wherein a heat transfer layer filled with a thermal interface material is disposed on the upper surface of the housing or the lower surface of the cover overlapping the electronic component in the vertical direction.
Public/Granted literature
- US20220377931A1 CONVERTER Public/Granted day:2022-11-24
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