- Patent Title: Flexible substrate with improved performance under bending stress
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Application No.: US17656891Application Date: 2022-03-29
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Publication No.: US12219832B2Publication Date: 2025-02-04
- Inventor: Takumi Sano
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP2021-063650 20210402
- Main IPC: H10K59/131
- IPC: H10K59/131 ; H10K77/10 ; H10K102/00

Abstract:
According to one embodiment, a flexible substrate includes an insulating base including first and second strip portions, and island-shaped portions, electrical elements, scanning lines each extending while overlapping the first strip portions, signal lines each extending while overlapping the second strip portions, connection wiring lines each extending while overlapping the second strip portions, a scanning line driver, a signal line driver, a support body including a first side edge, and scanning lines are connected to different connection wiring lines on different island-shaped portion, and the scanning line driver and the signal line driver are located on a side of the first side edge.
Public/Granted literature
- US20220320252A1 FLEXIBLE SUBSTRATE Public/Granted day:2022-10-06
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