Invention Grant
- Patent Title: Radio frequency (RF) system with embedded RF signal pickups
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Application No.: US17514815Application Date: 2021-10-29
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Publication No.: US12224164B2Publication Date: 2025-02-11
- Inventor: Chelsea Dubose , Barton Lane , Merritt Funk , Justin Moses , Yohei Yamazawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A radio frequency (RF) system including: a first conductive covering surface, a portion of the first conductive covering surface including a portion of the first outer wall of a first RF device; a second conductive covering surface aligned to the first conductive covering surface, the second conductive covering surface being disposed around the insulating hole; an insulating hole for an RF center conductor extending through the first conductive covering surface and the second conductive covering surface, the first conductive covering surface and the second conductive covering surface being disposed around the insulating hole; a cavity bounded by the first conductive covering surface and the second conductive covering surface, the cavity being an insulating region; and an RF signal pickup disposed within the cavity.
Public/Granted literature
- US20230132660A1 RADIO FREQUENCY (RF) SYSTEM WITH EMBEDDED RF SIGNAL PICKUPS Public/Granted day:2023-05-04
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