Invention Grant
- Patent Title: Laser-cut lead-frame for integrated circuit (IC) packages
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Application No.: US17458653Application Date: 2021-08-27
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Publication No.: US12224181B2Publication Date: 2025-02-11
- Inventor: Tiange Xie , Li Xiang Zheng , Alex Chin Sern Ting , Zhenzhen He
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Frank D. Cimino
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/495
Abstract:
One example described herein includes a method for fabricating integrated circuit (IC) packages. The method includes fabricating a plurality of IC dies and providing a conductive metal material sheet. The method also includes laser-cutting the conductive metal material sheet to form a lead-frame sheet. The lead-frame sheet includes at least one of through-holes and three-dimensional locking features. The method further includes coupling the IC dies to the lead-frame sheet and coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.
Public/Granted literature
- US20230063278A1 LASER-CUT LEAD-FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES Public/Granted day:2023-03-02
Information query
IPC分类:
