Invention Grant
- Patent Title: Electrostatic chuck with mesas
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Application No.: US18584937Application Date: 2024-02-22
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Publication No.: US12224198B2Publication Date: 2025-02-11
- Inventor: Vijay D. Parkhe , Ashutosh Agarwal
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32 ; H01L21/687
Abstract:
Electrostatic chucks (ESCs) for plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic top plate having a top surface with a processing region. One or more electrodes is within the ceramic top plate. A plurality of mesas is within the processing region and on the top surface of the ceramic plate or vertically over an edge of one of the one or more electrodes.
Public/Granted literature
- US20240242997A1 ELECTROSTATIC CHUCK WITH MESAS Public/Granted day:2024-07-18
Information query
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