Invention Grant
- Patent Title: Integrated mult-device chip and package
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Application No.: US17615927Application Date: 2019-06-03
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Publication No.: US12224279B2Publication Date: 2025-02-11
- Inventor: Tsung-Wen Mou , Lei Shi , Jifeng Zhou
- Applicant: Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Applicant Address: CN Wuxi
- Assignee: Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Current Assignee: Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Current Assignee Address: CN Wuxi
- Agency: KDW Firm PLLC
- International Application: PCT/CN2019/089797 WO 20190603
- International Announcement: WO2020/243875 WO 20201210
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L23/495 ; H01L23/31
Abstract:
A protection device may include a semiconductor substrate and a thyristor-type device, formed within the semiconductor substrate, where the thyristor device extends from a first main surface of the semiconductor substrate to a second main surface of the semiconductor substrate. The protection device may include a first PN diode, formed within the semiconductor substrate; and a second PN diode, formed within the semiconductor substrate, wherein the thyristor-type device is arranged in electrical series between the first PN diode and the second PN diode.
Public/Granted literature
- US20220320072A1 INTEGRATED MULT-DEVICE CHIP AND PACKAGE Public/Granted day:2022-10-06
Information query
IPC分类:
